Semiconductor Wafer Polishing Head from Germany
Carrier head assembly holding wafers against polishing pads in CMP (chemical mechanical planarization) tools for mirror-finish surfaces. Part of 8425 wafer polishers, classified 8431.10.0090. Achieves atomic-level flatness required for device fabrication.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include pressure/backing film specs proving semiconductor use; track consumable vs durable part status
• Pitfall: reclassification as 8481 valves if pneumatic features emphasized