Double-Sided Wafer Lapper Winch from Japan
Winch for simultaneous double-sided lapping of semiconductor wafers. HTS 8431.10.0010 for 8425.11.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document parallelism specs