Wafer Slicing Saw Coolant Nozzle from Germany
A specialized coolant nozzle for wafer slicing saws that disperses liquid coolant precisely onto diamond blades during semiconductor wafer cutting from crystal boules. Classified under HTS 8424.90.9080 as a part for mechanical appliances dispersing liquids in semiconductor processing equipment. Ensures precise wafer slicing without thermal damage.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include technical specs showing coolant dispersion function and semiconductor application; verify compatibility certificates for diamond saw integration; avoid misdeclaration as general spray nozzle to prevent duty hikes