Wafer Polisher Slurry Nozzle Array from Germany
Array of nozzles that evenly distribute polishing slurry across semiconductor wafers for mirror-finish surface preparation before fabrication. Under HTS 8424.90.9080 as parts dispersing liquid powders in wafer polishing appliances. Ensures optimal wafer flatness for device processing.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Include slurry flow rate specs and wafer size compatibility; nanotechnology cleanroom certs often required; avoid generic 'nozzle' description to prevent reclassification