Wafer Lapping Machine Coolant Dispenser from Canada
Precision dispenser part for lapping machines that projects coolant onto semiconductor wafers to maintain flatness during surface preparation. Falls under HTS 8424.90.9080 as a mechanical part for dispersing liquids in wafer processing equipment. Essential for achieving required wafer tolerances.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Document lapping process specs confirming liquid dispersion role; include cleanroom compatibility certifications; beware of bulk import thresholds triggering different valuation rules