Crystal Grinder Slurry Spray Head from Japan
This spray head disperses abrasive slurry onto crystal boules during grinding to achieve precise wafer diameters in semiconductor wafer preparation. It qualifies under HTS 8424.90.9080 as a part for projecting powders/liquids in mechanical grinding appliances for semiconductor processing. Critical for flat and diameter accuracy.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide evidence of slurry dispersion mechanism and semiconductor crystal grinding use; ensure HAZMAT docs for abrasive slurry compatibility; common pitfall is classification as grinding tool instead of spray part