8424.90.90.80/Crystal Grinder Slurry Spray Head/Japan

Crystal Grinder Slurry Spray Head from Japan

This spray head disperses abrasive slurry onto crystal boules during grinding to achieve precise wafer diameters in semiconductor wafer preparation. It qualifies under HTS 8424.90.9080 as a part for projecting powders/liquids in mechanical grinding appliances for semiconductor processing. Critical for flat and diameter accuracy.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide evidence of slurry dispersion mechanism and semiconductor crystal grinding use; ensure HAZMAT docs for abrasive slurry compatibility; common pitfall is classification as grinding tool instead of spray part

Crystal Grinder Slurry Spray Head from Japan — Import Duty Rate | HTS 8424.90.90.80