8424.89.90.00/Hydrofluoric Acid Vapor Etch Sprayer/Japan

Hydrofluoric Acid Vapor Etch Sprayer from Japan

Controlled vapor sprayer projecting HF vapor for native oxide removal from silicon wafers before processing. Classified HTS 8424.89.9000 as other chemical projecting appliances for semiconductors.

Duty Rate — Japan → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Include hazardous material handling certifications and etch rate specs

• Declare vapor generation mechanism separately from delivery nozzles