Edge Bead Removal Spray Tool from Japan
Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify edge exclusion zone specs (mm from edge) in technical docs
• Classify with track system as single lithography apparatus
• Common misclassification as general solvent sprayer to 8424.20