8424.89.90.00/Edge Bead Removal Spray Tool/Japan

Edge Bead Removal Spray Tool from Japan

Specialized nozzle array projecting solvent sprays to remove excess photoresist from wafer edges, preventing contamination. Classified HTS 8424.89.9000 for semiconductor-specific liquid projecting appliances.

Duty Rate — Japan → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify edge exclusion zone specs (mm from edge) in technical docs

• Classify with track system as single lithography apparatus

• Common misclassification as general solvent sprayer to 8424.20

Edge Bead Removal Spray Tool from Japan — Import Duty Rate | HTS 8424.89.90.00