8424.89.90.00/ backside Wafer Grind Coolant Dispenser/Japan

backside Wafer Grind Coolant Dispenser from Japan

Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.

Duty Rate — Japan → United States

11.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Document TTV (total thickness variation) control specs for classification

• Specify temporary adhesive compatibility of coolant formulation