8424.89.90.00/ backside Wafer Grind Coolant Dispenser/China

backside Wafer Grind Coolant Dispenser from China

Liquid dispenser projecting coolant during temporary bond/debond backside wafer grinding for 3D packaging. HTS 8424.89.9000 for semiconductor liquid projecting appliances.

Duty Rate — China → United States

36.8%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
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Import Tips

• Document TTV (total thickness variation) control specs for classification

• Specify temporary adhesive compatibility of coolant formulation

backside Wafer Grind Coolant Dispenser from China — Import Duty Rate | HTS 8424.89.90.00