Wafer Polisher Slurry Distribution Ring from Japan
Ceramic ring distributing polishing slurry evenly across wafer surface in chemical mechanical polishers. HTS 8422.90.91.95 part for wafer polishing equipment in semiconductor notes. Achieves global planarization for device fabrication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry chemistry compatibility; include material certs (e.g
• alumina ceramic); track wear rate specs