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8422.90.91.95/Wafer Polisher Slurry Distribution Ring/Japan

Wafer Polisher Slurry Distribution Ring from Japan

Ceramic ring distributing polishing slurry evenly across wafer surface in chemical mechanical polishers. HTS 8422.90.91.95 part for wafer polishing equipment in semiconductor notes. Achieves global planarization for device fabrication.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify slurry chemistry compatibility; include material certs (e.g

• alumina ceramic); track wear rate specs