Wafer Lapping Machine Polishing Pad from Mexico
Abrasive polishing pads for wafer lappers and polishers that achieve flatness tolerances for semiconductor fabrication readiness. Falls under HTS 8422.90.91.95 per statistical notes for wafer preparation machinery parts. Ensures mirror-finish wafer surfaces critical for device processing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify pad grit and flatness specs (<0.1 micron); use ESD-safe packaging; avoid bulk classification as generic abrasives