8422.90.91.95/Semiconductor Wafer Edge Grinder Collet/Japan

Semiconductor Wafer Edge Grinder Collet from Japan

Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Measure concentricity tolerances (<1 micron); declare wafer diameter compatibility; avoid general chuck classification

Semiconductor Wafer Edge Grinder Collet from Japan — Import Duty Rate | HTS 8422.90.91.95