8422.90.91.95/Semiconductor Wafer Edge Grinder Collet/Japan

Semiconductor Wafer Edge Grinder Collet from Japan

Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Measure concentricity tolerances (<1 micron); declare wafer diameter compatibility; avoid general chuck classification