Semiconductor Wafer Edge Grinder Collet from Germany
Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Measure concentricity tolerances (<1 micron); declare wafer diameter compatibility; avoid general chuck classification