Semiconductor Wafer Edge Grinder Collet from Germany
Precision collet chuck for holding wafers during edge grinding to remove damage layers post-slicing. Part of wafer grinder equipment under HTS 8422.90.91.95 statistical provisions for semiconductor processing. Maintains wafer roundness and edge quality.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Measure concentricity tolerances (<1 micron); declare wafer diameter compatibility; avoid general chuck classification