8422.90.91.95/Monocrystalline Silicon Ingot Saw Guide/Japan

Monocrystalline Silicon Ingot Saw Guide from Japan

Precision guide rails for wire saws slicing silicon ingots into wafers, maintaining parallel cuts. HTS 8422.90.91.95 part for wafer slicing saws in semiconductor statistical notes. Critical for uniform wafer thickness control.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Parallelism tolerance (<2 micron/meter) declaration; wire diameter compatibility; anti-wear coating specs