Wafer Slicing Saw Air Filtration Unit from Japan

Dust collection and mist filtration system for inner diameter saws that slice semiconductor wafers from crystal boules, capturing silicon particles and coolant aerosols from the cutting process. Under HTS 8421.39.0115 as air purification equipment integral to wafer preparation machinery in semiconductor fabs. Maintains ISO Class 1 cleanroom standards during high-volume wafer production.