8421.39.01.15/Wafer Slicing Saw Air Filtration Unit/Japan

Wafer Slicing Saw Air Filtration Unit from Japan

Dust collection and mist filtration system for inner diameter saws that slice semiconductor wafers from crystal boules, capturing silicon particles and coolant aerosols from the cutting process. Under HTS 8421.39.0115 as air purification equipment integral to wafer preparation machinery in semiconductor fabs. Maintains ISO Class 1 cleanroom standards during high-volume wafer production.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Demonstrate capture efficiency >99.97% for 0.3μm particles per DOE testing standards

• Link to specific saw models via integration certificates