Wafer Slicing Saw Air Filtration Unit from China
Dust collection and mist filtration system for inner diameter saws that slice semiconductor wafers from crystal boules, capturing silicon particles and coolant aerosols from the cutting process. Under HTS 8421.39.0115 as air purification equipment integral to wafer preparation machinery in semiconductor fabs. Maintains ISO Class 1 cleanroom standards during high-volume wafer production.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Demonstrate capture efficiency >99.97% for 0.3μm particles per DOE testing standards
• Link to specific saw models via integration certificates