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Wafer Slicing Saw Air Filtration Unit from Canada

Dust collection and mist filtration system for inner diameter saws that slice semiconductor wafers from crystal boules, capturing silicon particles and coolant aerosols from the cutting process. Under HTS 8421.39.0115 as air purification equipment integral to wafer preparation machinery in semiconductor fabs. Maintains ISO Class 1 cleanroom standards during high-volume wafer production.

Duty Rate — Canada → United States

10%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada

Import Tips

Demonstrate capture efficiency >99.97% for 0.3μm particles per DOE testing standards

Link to specific saw models via integration certificates