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8421.39.01.15/Wafer Edge Grinder Particle Trap/Japan

Wafer Edge Grinder Particle Trap from Japan

Localized particle trapping system for edge profiling grinders that create chip-separation geometry on wafers post-polish. HTS 8421.39.0115 for dust collection in final wafer preparation steps. Ensures edge quality for dicing yield.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Edge chipping tolerance data

• Inline with dicing process