Wafer Edge Grinder Particle Trap from Japan
Localized particle trapping system for edge profiling grinders that create chip-separation geometry on wafers post-polish. HTS 8421.39.0115 for dust collection in final wafer preparation steps. Ensures edge quality for dicing yield.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Edge chipping tolerance data
• Inline with dicing process