Wafer Edge Grinder Particle Trap from Canada
Localized particle trapping system for edge profiling grinders that create chip-separation geometry on wafers post-polish. HTS 8421.39.0115 for dust collection in final wafer preparation steps. Ensures edge quality for dicing yield.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Edge chipping tolerance data
• Inline with dicing process