Semiconductor Polisher Air Particle Collector from China
High-efficiency particulate air (HEPA) collector designed for chemical mechanical polishers that achieve mirror-flat wafer surfaces for device fabrication, capturing nano-scale slurry particles. HTS 8421.39.0115 applies as dust collection equipment for wafer preparation apparatus per chapter statistical notes. Enables defect-free semiconductor wafers for advanced nodes.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Tested filter specs (HEPA H14, 99.995% @ 0.1μm) required for duty preference
• Validate against specific CMP tool models