300mm Silicon Wafer Prep Dust Extraction Hood from Japan
Localized dust collection hood for 300mm wafer preparation lines including slicing, grinding, and polishing stations, filtering process-generated airborne particles. HTS 8421.39.0115 for semiconductor wafer manufacturing air purification equipment. Supports high-volume production of logic/memory wafers.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wafer size compatibility and fab tool integration
• Cleanroom airflow validation reports needed