Semiconductor Wafer Backgrind Tape Calender from Japan
Produces ultra-thin adhesive tape used for temporary wafer protection during backgrinding in semiconductor thinning processes. Falls under 8420.10.9080 for calendering plastic tape materials serving semiconductor manufacturing. Ensures tape thickness uniformity critical for wafer planarity.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify 'wafer backgrind tape' application in commercial invoice; provide semiconductor process documentation
• Confirm tape thickness tolerances meet 8480 specs
• Beware textile tape reclassification if fabric-reinforced