Semiconductor Wafer Backgrind Tape Calender from Japan
Produces ultra-thin adhesive tape used for temporary wafer protection during backgrinding in semiconductor thinning processes. Falls under 8420.10.9080 for calendering plastic tape materials serving semiconductor manufacturing. Ensures tape thickness uniformity critical for wafer planarity.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify 'wafer backgrind tape' application in commercial invoice; provide semiconductor process documentation
• Confirm tape thickness tolerances meet 8480 specs
• Beware textile tape reclassification if fabric-reinforced