Precision PVC Masking Film Rolling Machine from Japan
Calenders thin PVC films used as protective masking during semiconductor wafer dicing and packaging. Under 8420.10.9080 for plastic film rolling machines dedicated to semiconductor masking applications. Achieves sub-micron thickness control for clean removal.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify 'semiconductor wafer masking film' in all docs; include static dissipation specs
• Validate against 3918 adhesive tape provisions
• Confirm calender not classified as coating machinery