Cleanroom Polyimide Film Calendering Machine from Japan
Calenders polyimide films to micron-level thickness for flexible circuit substrates in semiconductor packaging. HTS 8420.10.9080 covers plastic film calendering machines used in advanced semiconductor substrate production. Provides dust-free rolling essential for high-reliability circuits.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include cleanroom certification (ISO 14644) in documentation; specify semiconductor substrate end-use
• Avoid generic 'plastic film machine' descriptions that trigger 8477 review
• Validate roller materials for ESD compliance