Wafer Slicing Saw Coolant Nozzle Assemblies from Mexico
Precision coolant nozzle manifolds for wafer slicing saws that deliver temperature-controlled fluid during diamond blade cuts of semiconductor boules. Maintains thermal stability per statistical note (a)(ii)(B) wafer preparation equipment. Parts of 8419 cooling process machinery.
Duty Rate — Mexico → United States
14%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify nozzle materials compatible with semiconductor-grade DI water coolant systems
• Include saw blade speed/temperature correlation data proving integral thermal function