Wafer Slicing Saw Coolant Nozzle Assemblies from Japan
Precision coolant nozzle manifolds for wafer slicing saws that deliver temperature-controlled fluid during diamond blade cuts of semiconductor boules. Maintains thermal stability per statistical note (a)(ii)(B) wafer preparation equipment. Parts of 8419 cooling process machinery.
Duty Rate — Japan → United States
14%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify nozzle materials compatible with semiconductor-grade DI water coolant systems
• Include saw blade speed/temperature correlation data proving integral thermal function