Wafer Slicing Saw Coolant Nozzle Assemblies from Germany
Precision coolant nozzle manifolds for wafer slicing saws that deliver temperature-controlled fluid during diamond blade cuts of semiconductor boules. Maintains thermal stability per statistical note (a)(ii)(B) wafer preparation equipment. Parts of 8419 cooling process machinery.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify nozzle materials compatible with semiconductor-grade DI water coolant systems
• Include saw blade speed/temperature correlation data proving integral thermal function