Wafer Slicing Saw Coolant Nozzle Assemblies from China
Precision coolant nozzle manifolds for wafer slicing saws that deliver temperature-controlled fluid during diamond blade cuts of semiconductor boules. Maintains thermal stability per statistical note (a)(ii)(B) wafer preparation equipment. Parts of 8419 cooling process machinery.
Duty Rate — China → United States
39%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify nozzle materials compatible with semiconductor-grade DI water coolant systems
• Include saw blade speed/temperature correlation data proving integral thermal function