Semiconductor Lapping Machine Temperature Control Units from Mexico
Integrated chiller/heater modules for wafer lapping equipment that maintain slurry temperature within 0.1°C tolerances during semiconductor wafer surface preparation. Directly referenced in statistical note (a)(ii)(C) as wafer grinders/lappers/polishers. Classifies as 8419.90.95 parts for temperature treatment.
Duty Rate — Mexico → United States
14%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide temperature uniformity specs (ASTM standards) proving semiconductor precision requirements
• Reference end-use in 200mm/300mm wafer fabs to qualify for manufacturing duty programs
• Avoid reclassification by documenting integration with lapping plate chillers