Semiconductor Lapping Machine Temperature Control Units from China
Integrated chiller/heater modules for wafer lapping equipment that maintain slurry temperature within 0.1°C tolerances during semiconductor wafer surface preparation. Directly referenced in statistical note (a)(ii)(C) as wafer grinders/lappers/polishers. Classifies as 8419.90.95 parts for temperature treatment.
Duty Rate — China → United States
41.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide temperature uniformity specs (ASTM standards) proving semiconductor precision requirements
• Reference end-use in 200mm/300mm wafer fabs to qualify for manufacturing duty programs
• Avoid reclassification by documenting integration with lapping plate chillers