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8419.90.50.80/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

High-precision inner-diameter saw with diamond blade for slicing monocrystalline boules into thin semiconductor wafers. Coolant systems manage heat from cutting process. Classified in 8419.90.50.80 as part for wafer manufacturing temperature treatment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Certify blade diamond specs and kerf loss tolerances; declare boule material compatibility; comply with cleanroom import packaging standards

Wafer Slicing Diamond Saw from Japan — Import Duty Rate | HTS 8419.90.50.80