Wafer Slicing Diamond Saw from Japan
High-precision inner-diameter saw with diamond blade for slicing monocrystalline boules into thin semiconductor wafers. Coolant systems manage heat from cutting process. Classified in 8419.90.50.80 as part for wafer manufacturing temperature treatment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify blade diamond specs and kerf loss tolerances; declare boule material compatibility; comply with cleanroom import packaging standards