8419.90.50.80/Semiconductor Wafer Lapper/Germany

Semiconductor Wafer Lapper from Germany

Lapping machine that uses abrasive slurries to flatten semiconductor wafers to optical tolerances, controlling slurry temperature for uniform material removal. Critical for wafer flatness before polishing. Under 8419.90.50.80 for semiconductor wafer prep equipment.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Document flatness specs (e.g

• <1μm TTV); include slurry system details; ensure calibration traceability for metrology