</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8419.90.50.80/GaAs Wafer Grinder/Japan

GaAs Wafer Grinder from Japan

Backside grinder for gallium arsenide (GaAs) wafers, using controlled grinding wheels and coolant to thin wafers while managing heat to prevent cracking. Used after epi-layer growth. Part under 8419.90.50.80 for compound semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Certify GaAs-specific wheel compositions; include handling certs for brittle materials; specify target thickness uniformity