8419.90.50.80/GaAs Wafer Grinder/Japan

GaAs Wafer Grinder from Japan

Backside grinder for gallium arsenide (GaAs) wafers, using controlled grinding wheels and coolant to thin wafers while managing heat to prevent cracking. Used after epi-layer growth. Part under 8419.90.50.80 for compound semiconductor processing.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify GaAs-specific wheel compositions; include handling certs for brittle materials; specify target thickness uniformity

GaAs Wafer Grinder from Japan — Import Duty Rate | HTS 8419.90.50.80