GaAs Wafer Grinder from Japan
Backside grinder for gallium arsenide (GaAs) wafers, using controlled grinding wheels and coolant to thin wafers while managing heat to prevent cracking. Used after epi-layer growth. Part under 8419.90.50.80 for compound semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify GaAs-specific wheel compositions; include handling certs for brittle materials; specify target thickness uniformity