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8419.90.50.80/GaAs Wafer Grinder/Germany

GaAs Wafer Grinder from Germany

Backside grinder for gallium arsenide (GaAs) wafers, using controlled grinding wheels and coolant to thin wafers while managing heat to prevent cracking. Used after epi-layer growth. Part under 8419.90.50.80 for compound semiconductor processing.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Certify GaAs-specific wheel compositions; include handling certs for brittle materials; specify target thickness uniformity

GaAs Wafer Grinder from Germany — Import Duty Rate | HTS 8419.90.50.80