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8419.90.50.80/Double-Sided Wafer Polisher/Germany

Double-Sided Wafer Polisher from Germany

Chemical-mechanical planarization (CMP) polisher for simultaneous double-sided polishing of silicon wafers, maintaining precise temperature control of polishing pads and slurries. Prepares wafer surface for device fabrication. Fits 8419.90.50.80 as semiconductor processing part.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify pad pressure and slurry flow rates; provide cleanroom compatibility certs; declare endpoint detection systems

Double-Sided Wafer Polisher from Germany — Import Duty Rate | HTS 8419.90.50.80