Double-Sided Wafer Polisher from Canada
Chemical-mechanical planarization (CMP) polisher for simultaneous double-sided polishing of silicon wafers, maintaining precise temperature control of polishing pads and slurries. Prepares wafer surface for device fabrication. Fits 8419.90.50.80 as semiconductor processing part.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify pad pressure and slurry flow rates; provide cleanroom compatibility certs; declare endpoint detection systems