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8419.90.50.80/Crystal Boule Grinder/Japan

Crystal Boule Grinder from Japan

Precision grinder for shaping semiconductor crystal boules to exact diameter and flats indicating conductivity type. Generates controlled heat during grinding for material treatment. Part of wafer prep equipment under 8419.90.50.80 for temperature-involved semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify flat orientation standards (e.g

• ASTM); provide material compatibility certs for silicon/GaAs; avoid misclassification as general tooling