Wafer Slicing Saw Coolant Radiator Core from Japan
Tube-fin radiator core for coolant systems in wire saws slicing silicon boules into wafers, dissipating heat from high-speed diamond wire cutting. HTS 8419.90.30.00 covers it as heat exchanger part in semiconductor wafer manufacturing equipment. Maintains wire tension and cut quality through thermal stability.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wire speed/tension specs linking to slicing process; cleanroom packing required
• Pitfall: bulk packaging damage during ocean transit without proper cushioning