Wafer Slicing Saw Coolant Radiator Core from Japan
Tube-fin radiator core for coolant systems in wire saws slicing silicon boules into wafers, dissipating heat from high-speed diamond wire cutting. HTS 8419.90.30.00 covers it as heat exchanger part in semiconductor wafer manufacturing equipment. Maintains wire tension and cut quality through thermal stability.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include wire speed/tension specs linking to slicing process; cleanroom packing required
• Pitfall: bulk packaging damage during ocean transit without proper cushioning