Of heat exchange units
Machinery, plant or laboratory equipment, whether or not electrically heated (excluding furnaces, ovens and other equipment of heading 8514), for the treatment of materials by a process involving a change of temperature such as heating, cooking, roasting, distilling, rectifying, sterilizing, pasteurizing, steaming, drying, evaporating, vaporizing, condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water heaters, nonelectric; parts thereof: > Parts: > Of heat exchange units
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8419.90.30.00
Semiconductor Wafer Cooling Heat Exchanger Coil
A finned-tube heat exchanger coil designed specifically for cooling chambers in semiconductor wafer processing equipment, facilitating rapid temperature control during etching and deposition processes. It falls under HTS 8419.90.30.00 as a part of heat exchange units used in industrial temperature treatment machinery for semiconductor manufacturing. This component ensures precise cooling of process gases and wafers to prevent thermal damage.
Czochralski Crystal Puller Heat Exchanger Assembly
A specialized heat exchanger module for Czochralski method crystal growers, controlling melt temperature gradients to produce monocrystalline silicon boules for wafers. Classified under HTS 8419.90.30.00 as parts of heat exchange units in temperature-controlled semiconductor material growth equipment. It maintains precise thermal stability essential for defect-free crystal formation.
Wafer Lapping Process Chiller Heat Exchanger Plate
Brazed plate heat exchanger for chillers in wafer lapping and polishing machines, removing heat from coolant to achieve nanoscale flatness tolerances. Under HTS 8419.90.30.00 as a component of heat exchange units in semiconductor wafer preparation equipment. Critical for maintaining slurry temperatures during precision grinding.
Float Zone Crystal Furnace Heat Exchanger
RF-heated zone furnace heat exchanger for float zone purification of silicon rods into monocrystalline material for wafer production. HTS 8419.90.30.00 covers it as part of heat exchange units in high-temperature semiconductor crystal processing machinery. Manages radiative and convective heat for impurity segregation.
Semiconductor Vapor Phase Epitaxy Reactor Heat Exchanger
Shell-and-tube heat exchanger for VPE reactors, condensing precursor vapors and controlling epitaxial layer growth temperatures on wafers. Classified in HTS 8419.90.30.00 for heat exchange parts in semiconductor thin-film deposition equipment involving temperature change processes. Ensures uniform deposition without thermal runaway.
Wafer Crystal Grinder Coolant Heat Exchanger
Compact coolant-to-water heat exchanger for crystal grinders, maintaining boule grinding temperatures to precise diameters for wafer slicing. HTS 8419.90.30.00 as part of heat exchange units in semiconductor wafer preparation machinery. Prevents thermal distortion during flat grinding for conductivity indication.
Plasma Etch Chamber Heat Exchanger Manifold
Multi-channel heat exchanger manifold for plasma etch chambers, recovering heat from exhaust gases in semiconductor wafer patterning equipment. Under HTS 8419.90.30.00 for heat exchange components in temperature-controlled etching machinery. Supports high-throughput RIE processes with thermal management.
Wafer Slicing Saw Coolant Radiator Core
Tube-fin radiator core for coolant systems in wire saws slicing silicon boules into wafers, dissipating heat from high-speed diamond wire cutting. HTS 8419.90.30.00 covers it as heat exchanger part in semiconductor wafer manufacturing equipment. Maintains wire tension and cut quality through thermal stability.
Chemical Vapor Deposition Chamber Heat Exchanger
Immersion-type heat exchanger for CVD chambers, preheating carrier gases for uniform semiconductor thin film deposition on wafers. Classified HTS 8419.90.30.00 as part of heat exchange units in vapor deposition temperature treatment equipment. Critical for precursor vaporization control.
Silicon Ingot Annealing Oven Heat Exchanger
Recuperative heat exchanger for annealing furnaces, recovering heat during silicon ingot stress relief post-crystal growth for wafer production. HTS 8419.90.30.00 for heat exchange parts in semiconductor material treatment equipment. Improves energy efficiency in high-temperature annealing cycles.