Wafer Lapping Process Chiller Heat Exchanger Plate from Japan
Brazed plate heat exchanger for chillers in wafer lapping and polishing machines, removing heat from coolant to achieve nanoscale flatness tolerances. Under HTS 8419.90.30.00 as a component of heat exchange units in semiconductor wafer preparation equipment. Critical for maintaining slurry temperatures during precision grinding.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document wafer flatness specs (e.g
• <1μm) linking to lapping process; use ISPM-15 compliant packaging for cleanroom delivery
• Avoid pitfall: incomplete bills of materials causing CBP to classify as general chiller parts