Wafer Crystal Grinder Coolant Heat Exchanger from Japan
Compact coolant-to-water heat exchanger for crystal grinders, maintaining boule grinding temperatures to precise diameters for wafer slicing. HTS 8419.90.30.00 as part of heat exchange units in semiconductor wafer preparation machinery. Prevents thermal distortion during flat grinding for conductivity indication.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond abrasive coolant flow rates in docs; ensure pressure vessel certification (ASME)
• Pitfall: classifying as machine tool part under 8466 without semiconductor context