Wafer Crystal Grinder Coolant Heat Exchanger from China
Compact coolant-to-water heat exchanger for crystal grinders, maintaining boule grinding temperatures to precise diameters for wafer slicing. HTS 8419.90.30.00 as part of heat exchange units in semiconductor wafer preparation machinery. Prevents thermal distortion during flat grinding for conductivity indication.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify diamond abrasive coolant flow rates in docs; ensure pressure vessel certification (ASME)
• Pitfall: classifying as machine tool part under 8466 without semiconductor context