Semiconductor Wafer Cooling Heat Exchanger Coil from China
A finned-tube heat exchanger coil designed specifically for cooling chambers in semiconductor wafer processing equipment, facilitating rapid temperature control during etching and deposition processes. It falls under HTS 8419.90.30.00 as a part of heat exchange units used in industrial temperature treatment machinery for semiconductor manufacturing. This component ensures precise cooling of process gases and wafers to prevent thermal damage.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Verify compatibility with cleanroom standards (ISO 14644) and provide manufacturer specs confirming use in heat exchange units; obtain end-user certificates for semiconductor machinery to avoid reclassification
• Common pitfall: inadequate documentation of non-domestic use leading to duty disputes