Plasma Etch Chamber Heat Exchanger Manifold from Japan
Multi-channel heat exchanger manifold for plasma etch chambers, recovering heat from exhaust gases in semiconductor wafer patterning equipment. Under HTS 8419.90.30.00 for heat exchange components in temperature-controlled etching machinery. Supports high-throughput RIE processes with thermal management.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document plasma compatibility (e.g
• Teflon-lined for fluorinated chemistries); provide etch rate correlations
• Avoid: incomplete hazardous material declarations for chamber residues