Plasma Etch Chamber Heat Exchanger Manifold from Canada
Multi-channel heat exchanger manifold for plasma etch chambers, recovering heat from exhaust gases in semiconductor wafer patterning equipment. Under HTS 8419.90.30.00 for heat exchange components in temperature-controlled etching machinery. Supports high-throughput RIE processes with thermal management.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Document plasma compatibility (e.g
• Teflon-lined for fluorinated chemistries); provide etch rate correlations
• Avoid: incomplete hazardous material declarations for chamber residues