Wafer Slicing Diamond Saw from Mexico
Wafer slicing diamond saws cut ultra-thin slices from monocrystalline semiconductor boules using coolant systems with precise temperature regulation to maintain crystal integrity during high-speed cutting. Critical step in wafer manufacturing per statistical note. Falls under HTS 8419.89.95 for its cooling-involved material processing.
Duty Rate — Mexico → United States
14.2%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond wire or blade specs for semiconductor slicing to match statistical note (a)(ii)(B)
• Include wafer thickness tolerance data (typically <100μm) for classification support
• Watch for reclassification if saw lacks semiconductor-specific precision features