Wafer Slicing Diamond Saw from Japan
Wafer slicing diamond saws cut ultra-thin slices from monocrystalline semiconductor boules using coolant systems with precise temperature regulation to maintain crystal integrity during high-speed cutting. Critical step in wafer manufacturing per statistical note. Falls under HTS 8419.89.95 for its cooling-involved material processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond wire or blade specs for semiconductor slicing to match statistical note (a)(ii)(B)
• Include wafer thickness tolerance data (typically <100μm) for classification support
• Watch for reclassification if saw lacks semiconductor-specific precision features