Wafer Polishing Machine from China
Chemical mechanical polishing (CMP) machines for semiconductor wafers use rotating pads and temperature-controlled slurries to achieve mirror-finish surfaces with atomic-level flatness required for lithography. Statistical note (a)(ii)(C) preparation equipment. Temperature process justifies HTS 8419.89.95.
Duty Rate — China → United States
41.7%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0225%Except as provided in headings 9903.88.12, 9903.88.17, 9903.88.20, 9903.88.54, 9903.88.59, 9903.88.61, 9903.88.63, 9903.88.66, 9903.88.67, 9903.88.68, 9903.88.69, or 9903.88.70, articles the product of China, as provided for in U.S. note 20(c) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(d)
Import Tips
• Include CMP-specific slurry chemistry and platen temperature specs in entry docs
• Distinguish from general polishers by wafer size (200mm/300mm) and nanometer precision
• Leverage statistical note language for favorable duty treatment