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8419.89.95/Wafer Polishing Machine/Canada

Wafer Polishing Machine from Canada

Chemical mechanical polishing (CMP) machines for semiconductor wafers use rotating pads and temperature-controlled slurries to achieve mirror-finish surfaces with atomic-level flatness required for lithography. Statistical note (a)(ii)(C) preparation equipment. Temperature process justifies HTS 8419.89.95.

Duty Rate — Canada → United States

14.2%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Include CMP-specific slurry chemistry and platen temperature specs in entry docs

• Distinguish from general polishers by wafer size (200mm/300mm) and nanometer precision

• Leverage statistical note language for favorable duty treatment

Wafer Polishing Machine from Canada — Import Duty Rate | HTS 8419.89.95